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High thermal conductivity substrate - List of Manufacturers, Suppliers, Companies and Products

High thermal conductivity substrate Product List

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High thermal conductivity substrate "Metal substrate"

You can freely choose the layer composition according to your needs! Customization is also possible for various specifications of the substrate!

"Metal substrates" are high thermal conductivity substrates designed to efficiently conduct and dissipate heat generated by LEDs and power semiconductors to enclosures or heat sinks. They utilize the thermal conductivity of the base or core metal. The layer composition can be freely selected depending on the application. It is also possible to customize various specifications of the substrate, such as the thickness and type of base metal, the thermal conductivity of the insulation layer, and the thickness of the pattern copper, according to the purpose. [Features] ■ The layer composition can be freely selected depending on the application - Metal base substrate - Multi-layer metal base substrate - Metal core substrate (Aluminum) - Metal core substrate (Copper) ■ Customization of various specifications of the substrate is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Company:HNS
  • Price:Other
  • others
  • Printed Circuit Board

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High Thermal Conductivity Substrate "FGHP"

Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!

"FGHP" is a flat heat pipe-type heat spreader that forms a sealed space and wick (capillary structure) inside an ultra-thin metal sheet. It supports the reduction of thermal density and efficient heat dissipation by uniformly spreading the high-density heat generated by a small, high-output heat source across the surface through its excellent thermal diffusion capability. 【Features】 ■ Excellent thermal diffusion (heat pipe structure) ■ Thin design (micro-etching technology) ■ Lightweight (hollow structure) ■ High reliability (high-strength sealed structure) ■ Can be installed vertically (internal microstructure) *For more details, please download the PDF or contact us.

  • Board to Board Connectors

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